Soldering and welding require the application of heat, which can be a danger to delicate electrical equipment that might get damaged in the process.
Scientists have developed a new type of metallic glue that can join two pieces of metal together at room temperature with no heat involved.
A team of material scientists at Boston’s Northeastern University have created ‘MesoGlue.’ It can bond metal to metal or any other material.
How MesoGlue Works
MesoGlue is made up of microscopic nanorods that have a metal core. Some of them are covered with indium and some with gallium. Both gallium and indium are kept separate until a bond is required.
When a bond is required, a layer of the indium-coated rods is applied to one metal surface, while a layer of the gallium-coated rods is applied to the other surface. The nanorods in both cases stand up from the surface like the teeth of a comb.
MesoGlue has the potential to replace soldering and welding.
When the two surfaces are pressed together, the nanorods interlock like Velcro, binding the two surfaces together. Since no additional application of heat is required, it’s completely safe for electronic components. Besides that, the strength of the bond matches the strength of a traditional weld or solder.